Optimization of electronic boards equipped with the BGA package to improve the response in random vibration

Document Type : Persian

Authors

1 MSc Student, Department of Islamic Azad University, Tehran North Branch, Tehran, Iran

2 - Assistant Professor, Department of K.N.TOOSI University of technology, Tehran, Iran

Abstract

 
In this paper deflection and free vibration of sandwich panel is studied. The core of Sandwich panels is made of hexagonal honeycomb and faces are made of two different materials of Carbon Fiber Reinforced Plastic and K-aryl/epoxy covering. The governing equations are deduced from the First order Sheer Deformation Theory (FSDT) and they are solved using Generalized
Differential Quadrature Method (GDQM). The classical method in the references is used to verify the DQ method and to show that the applied GDQM method has a good results with compared to the references. Deflection of sandwich panel is investigated with two different load types. Finally natural frequency for the first 4 modes and the two different faces materials are calculated and the effect of various lengths to core thickness ratios and faces to honeycomb core thickness ratios are studied. Further, the effect of foundation stiffness coefficient on deflection and natural frequency are showed.
 

Keywords

References

[1] Yeong K. Kim, Do Soon Hwang, PBGA packaging reliability assessments under random vibrations for space applications, Microelectronics Reliability, 2015, pp. 1-2.
[2] Da Yu a, Abdullah Al-Yafawi, Tung T. Nguyen, Seungbae Park, Soonwan Chung ,High-cycle fatigue life prediction for Pb-free BGA under random vibration loading, Microelectronics Reliability, 2011, pp. 1-3.
[3] H.W. Zhang, Y. Liu, J. Wang, F.L. Sun, Effect of elevated temperature on PCB responses and solder interconnect reliability under vibration loading, Microelectronics Reliability, 2015, pp. 1-2.
[4] Cholmin Choi, Abhijit Dasgupta, Fatigue of Solder Interconnects in Microelectronic Assemblies under Random Vibration, Procedia Engineering, 2014, pp. 1-2.
[5] M. Mirgkizoudi, C. Liu, P.P. Conway, S. Riches, Mechanical and electrical characterisation of Au wire interconnects in electronic packages under the combined vibration and thermal testing conditions, Microelectronics Reliability, 2015, pp. 1-2.
[6] F.X. Che, John H.L. Pang, Study on reliability of PQFP assembly with lead free solder joints under random vibration test, Microelectronics Reliability, 2015, pp. 1-2.
[7] Fang Liu, Guang Meng, Random vibration reliability of BGA lead-free solder joint, 2014, pp. 1-2.
[8] Ying Ding, RuyuTian, XiuliWang, Chunjin Hang, FangYu, Ling Zhou, XiangangMeng, Yanhong Tian, Coupling effects of mechanical vibrations and thermal cycling on reliability of CCGA solder joints, 2015, pp. 1-2.
 
 
 
 
 
 
Journal of Simulation and Analysis of Novel Technologies in Mechanical Engineering
Volume 10, Issue 1 - Serial Number 28
February 2017
Pages 701-710

Files

Share

How to cite

Statistics